Electronic News

Wafer-fabrication and chip-assembly factories addition for RA2E1 QFN and LQFP package products Produ

■Description of Change: Case1: QFN package products ▲Wafer fab: Powerchip Semiconductor Manufacturing Corporation PSMC addition Case2: LQFP package products ▲Wafer fab: Powerchip Semiconductor Manufacturing

MCU/SOC products announcement of Full Carton Product Change Notice (PCN) (SAG-B-22-0002)

Subject: MCU/SOC products announcement of Full Carton Revision Description: Initial release Description of Change: Renesas will change packing form with a tray to Full Carton full packing from fraction.

Product Change Notice (PCN)：Add tray and desiccant for RA Family/RA2 Series LQFP (MCO-AC-23-0002)

■Subject: Add tray and desiccant for RA Family/RA2 Series LQFP.■Publication Date: 1/26/2023■Effective Date: 5/1/2023■Revision Description: Initial Release■Description of Change: Applicable products: RA

650V IGBTs co-packed with FRED diodes Product Termination Notice (LFPTNIGBT2023-001)

Littelfuse would like to notify the discontinuation of 650V IGBTs co-packed with FRED diodes listed in Appendix A. The reason for the termination of these IGBTs is the termination of material supply by

RA/SYNERGY 176pin LQFP Change Back-end Factory for customer(IMO-AB-23-0009)

■Subject: Back-end factory and material change for RA RA6M3 /SYNERGY S5D9 176pin-LQFP products.■Publication Date: 2/10/2023■Effective Date: 7/3/2023■Revision Description: Initial Release■Description of

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