● Notification subject: CCB 4109 Initial Notice: Qualification of DEI6 as a new assembly site for selected ATML ATSAMR21B18 and ATSAMR21G18 device families available in 9L and 48L Module package.
● Description of Change: Qualification of DEI6 as a new assembly site for selected ATML ATSAMR21B18 and ATSAMR21G18 device families available in 9L and 48L Module package.
● Reason for Change: To improve on-time delivery performance by qualifying DEI6 as a new assembly site.

Brand of Product：	MICROCHIP
Part#：	ATSAMR21B18 、 ATSAMR21G18 More Part#
Product Category：	Wireless Modules More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	18 Feb 2020
Version Number：
Data Encoding：	JAON-07XXOG939
Data Size：	24 KB