●Product Identification: PC745BVGH350LE
●Reason for Change: Processing
●Change Description:
■This PC745 wafer die exists in 2 variants exhibiting slower or faster behaviour. The adjustment consists in die process parameters slight trimming. The PC745BVGH350LE will be produced using the faster die variant.
■Although the fit form and function of the device have not changed, the typical mean power dissipation value has increased by about +20%. The specified maximum power dissipation value is unchanged.

Brand of Product：	TELEDYNE E2V
Part#：	PC745BVGH350LE More Part#
Product Category：	More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	January 23rd, 2014
Version Number：	Rev L
Data Encoding：	GC140452
Data Size：	27 KB