●SUBJECT OF CHANGE：Improved design for MiniSKiiP® Blister
●PRODUCTS AFFECTED：MiniSKiiP® 0,1,2,3 blister packaging
●REASON OF CHANGE:Enable the removal of modules from the cover and the tray Improved protection against dust/pollution/contamination Improved mechanical stability
●DESCRIPTION OF CHANGE:
■Changes are illustrated using MiniSKiiP®housing size 2 blister image (all MiniSKiiP®blister sized are affected by the changes).
◆CURRENT：Open edge all around
◆NEW：Closed edge all around
◆CURRENT：Annular support in the middle only, module tilting is possible
◆NEW：Flat support on edges, no module tilting is possible

Brand of Product：	Vincotech
Part#：
Product Category：	More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2021-10-29
Version Number：
Data Encoding：	39-2021
Data Size：	425 KB