●Product Identification: PC8245/8260/8265 product family
●Reason for Change: Process Material; Assembly Material
●Change Description:
■Teledyne e2v aligns with NXP announcement ref. 201803021F01.
◆TBGA Package encapsulation process change from Glob Top to Center Gate Mold.

Brand of Product：	TELEDYNE E2V
Part#：	PC8245MTPU300D 、 PC8245MTPU333D 、 PC8245MTPU350D 、 PC8260AMTPUMHBB 、 PC8260AMTPUMHBBZG2 、 PC8265AMTPUMHBC 、 PC8245 、 PC8260 、 PC8265 More Part#
Product Category：	More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	TBGA
Language：	English Chinese Chinese and English Japanese
Date of Creation：	29 April 2019
Version Number：	Rev L
Data Encoding：	GC191443
Data Size：	136 KB